ASML and Imec Launch High NA EUV Lithography Lab in Veldhoven

ASML and Imec have inaugurated a new test laboratory in the Netherlands for High NA EUV lithography equipment, valued at €350 million. The facility will allow chipmakers and suppliers to test the state-of-the-art tool, expected to lead to smaller, faster, and more efficient chips.

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Nimrah Khatoon
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ASML and Imec Launch High NA EUV Lithography Lab in Veldhoven

ASML and Imec Launch High NA EUV Lithography Lab in Veldhoven

ASML, the largest manufacturer of semiconductor manufacturing equipment, and Belgium's chip research firm Imec have inaugurated a new test laboratory in Veldhoven, Netherlands. This facility will allow leading chipmakers and suppliers to test the latest High NA EUV lithography equipment, a state-of-the-art tool valued at €350 million (approximately $380 million).

Why this matters: The development of High NA EUV lithography equipment has significant implications for the future of chipmaking and the technology industry as a whole. This advancement could lead to the production of smaller, faster, and more efficient chips, which could have a profound impact on various industries and aspects of modern life.

The High NA EUV lithography equipment offers up to 60% better resolution compared to current EUV machines. This advancement is expected to lead to the production of new generations of smaller, faster chips. Commercial manufacturing with this tool is anticipated to begin in the 2025-2026 timeframe.

ASML dominates the market for lithography equipment, a vital step in the chipmaking process. Currently, only a few chip manufacturers, including TSMC, Samsung, Intel, and memory specialists SK Hynix and Samsung, are capable of manufacturing using ASML's current generation of extreme ultraviolet (EUV) machines.

The new laboratory is the first of its kind and represents a significant milestone in the preparation of High NA EUV lithography for high-volume manufacturing. The facility will provide chipmakers and suppliers access to the first prototype High NA EUV scanner (TWINSCAN EXE:5000) and surrounding processing and metrology tools.

ASML has already shipped one other test machine to Intel in the United States, which plans to use the tool in its 14A process in 2025. ASML has received orders for more than a dozen High NA tools, although TSMC, its largest customer for EUV equipment, has stated that it does not need to use High NA tools for its A16 chips, expected to enter production in 2025.

The collaboration between ASML and Imec is the result of years of development. Preparatory work for the lab started in 2018, with ASML and ZEISS developing High NA EUV scanner-specific solutions, and Imec preparing the patterning ecosystem. The first exposures using the 0.55 NA EUV prototype scanner have already been successful, printing 10 nm dense lines (20 nm pitch) on metal oxide resists (MORs).

Luc Van den hove, Imec's President and CEO, stated, 'High NA EUV is the next milestone in optical lithography, promising the patterning of metal lines/spaces with 20 nm pitch in one single exposure and enabling next generations of DRAM chips.' Christophe Fouquet, ASML's President and CEO, added, 'The ASML-imec High NA EUV Lithography Lab provides an opportunity for our EUV customers, partners, and suppliers to access the High NA EUV system for process development while waiting for their own system to be available at their factories.'

ASML and Imec's new laboratory marks a significant step in advancing semiconductor technology. The industry's preparation for high-volume manufacturing with High NA EUV lithography hinges on the collaboration between these two giants, which will likely play a vital role in shaping the future of chipmaking.

Key Takeaways

  • ASML and Imec open High NA EUV lithography lab in Netherlands.
  • New equipment offers 60% better resolution than current EUV machines.
  • Commercial manufacturing expected to begin in 2025-2026 timeframe.
  • Lab provides access to first prototype High NA EUV scanner and tools.
  • Advancement could lead to smaller, faster, and more efficient chips.